MOLDEX3D

Moldex3D eDesign

Moldex3D eDesign has been specifically developed as an easy-to-use package, allowing plastic product designers to quickly assess and check their designs as an integrated stage of their CAD workflows.

• Automatic 3D meshing systems, reducing user effort and training requirements
• Fast and easy model preparation, including incorporation of melt delivery and cooling systems
• Fast yet powerful 3D calculation engine, with high performance parallel processing, generating highly accurate results
• Comprehensive visualization capabilities, facilitating effective communication and collaboration

Accurate flow and thermal simulation results provide invaluable insight into the proposed molding process, enabling the design to be optimized before prototype testing or manufacture and supporting Design-for-Manufacture (DfM) goals.

Key capabilities

• Flow
• Pack
• Cool

• Warp
• Multi-Component Molding (MCM)
• Reactive Injection Molding (RIM)

Professional

Boundary Layer Mesh (BLM)

Advanced yet robust meshing is key to obtaining high fidelity results from challenging simulations. Consequently, Moldex3D Professional  contains an advanced BLM (Boundary Layer Mesh) module with Non-Matching mesh technology to provide more flexibility when modelling parts and molds.

This unique capability enables different element types and mesh configurations to be applied to various components of the injection molding model, including cavities, part inserts, runners and cooling channels. Although Moldex3D will conveniently define a suitable surface mesh and layer configuration by default for reliable results, users can also further adjust settings, such as mesh size, number of boundary layers and offset ratios, to create the ideal mode for their requirements – balancing accuracy and speed.

Furthermore, Moldex3D permits non-matching meshes between components for all standard analysis types, including flow, pack, cool and warp, with the solver handling the contact interfaces automatically. This is a highly valuable time-saving feature, benefiting the user by reducing mesh preparation time and effort.

3D Coolant  CFD

Cooling performance can be critical within injection molding when improving quality and cycle time.  Moldex3D’s 3D Coolant CFD solver predicts flow behaviour within conformal and variable cooling channels to help design an efficient thermal system. This includes identification of areas of stagnant or “dead” flow, potentially caused by cooling channel size changes. It can also accurately simulate Rapid Heat Cycle Molding (RHCM) systems.

Key capabilities

• Flow
• Pack
• Cool

• Warp
• Multi-Component Molding (MCM)
• Reactive Injection Molding (RIM)

• 3D Coolant CFD
• BLM (Boundary Layer Mesh

Advanced

Moldex3D Advanced adds further advanced capabilities to Professional to give total flexibility to users at all levels, from product and mould designers to advanced CAE experts.

Combining the advantages of 2.5D and 3D modelling, a variety of meshing tools are included to accurately simulate complex shapes, from thin-wall moulded parts to complex models with fine features, including flow behaviour around gates and corners.  A range of robust solid finite elements enable highly detailed resolution in specific regions, while 2.5D mid-plane shell elements offer fast solve times when appropriate to use.

Key capabilities

• Flow
• Pack
• Cool

• Warp
• Multi-Component Molding (MCM)
• Reactive Injection Molding (RIM)

• 3D Coolant CFD
• BLM (Boundary Layer Mesh

IC Packaging

Plastic Chip Encapsulation involves chips being capsulated within Epoxy Molding Compound (EMC) to prevent physical damage or corrosion.

This process is typically very challenging due to complexity of multiple material components, such as EMC, chip, or lead frame, interconnection between microchips and other electronics (so-called wire bonding), curing phenomenon of thermoset material, and control management of process conditions.

Defects that can commonly result include incomplete fill, air traps, voids, wire sweep, paddle shift, package warpage.

Moldex3D IC Packaging is a dedicated solution for overcoming these challenges. A comprehensive toolset helps designers fully analyse the chip encapsulation process from filling, curing, cooling, to advanced manufacturing demands, such as filler concentration, underfill encapsulation, post-moulding curing, stress distribution, or structural evaluation.

By enabling a virtual design optimisation workflow,  significant moulding problems within IC packaging manufacturing processes can be more efficiently addressed upfront, enhancing chip quality and reducing cost.

Key capabilities

• Transfer Molding
• Molded Underfill
• Capillary Underfill (CUF)

• Compression Molding
• Embedded Wafer Level Package (EMWLP)
• No Flow Underfill (NFU) / Non Conductive Paste (NCP)

Viewer

Moldex3D Viewer is a comprehensive communication platform, enabling users to visualise Moldex3D’s analysis results easily and quickly while supporting cross-departmental discussion and collaboration.

As a Free Download, results can be shared and discussed by all stakeholders within a project, such as part designers, mold makers, tooling engineers, partners and customers, increasing overall productivity.

Moldex3D IC Packaging is a dedicated solution for overcoming these challenges. A comprehensive toolset helps designers fully analyse the chip encapsulation process from filling, curing, cooling, to advanced manufacturing demands, such as filler concentration, underfill encapsulation, post-moulding curing, stress distribution, or structural evaluation.

By enabling a virtual design optimisation workflow,  significant moulding problems within IC packaging manufacturing processes can be more efficiently addressed upfront, enhancing chip quality and reducing cost.

Key capabilities

• Post-processes results from eDesign, Solid, and Shell models exported from a Moldex3D Project
• Enables detailed analysis through a range of inspection tools, including slicing and x-y plots of the entire molding process cycle
• Measures warpage and evaluates mold compensation
• Allows customization of results for analysis collaboration and reduced file sizes
• Provides grouped tree views to organise different of results
• Generates result animations for reports and presentations

Need extra capabilities?

Moldex3D software can be configured further for your specific processes and requirements to maximise productivity